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Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods (2014)

First Author: Arjmand E

Attributed to: HubNet: Research Leadership and Networking for Energy Networks funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2014.07.119

Publication URI: http://dx.doi.org/10.1016/j.microrel.2014.07.119

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 9-10