Technology for integrated circuit micropackages for neural interfaces, based on gold-silicon wafer bonding (2013)
Attributed to:
A NOVEL ACTIVE ELECTRODE BOOK FOR MULTI-FUNCTIONAL RESTORATION AFTER SPINAL CORD INJURY
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1088/0960-1317/23/7/075021
Publication URI: http://dx.doi.org/10.1088/0960-1317/23/7/075021
Type: Journal Article/Review
Parent Publication: Journal of Micromechanics and Microengineering
Issue: 7