Characterization and Mechanical Reliability Evaluation of Gold Polysilicon Eutectic Bonded Wafers (2010)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1149/1.3483498

Publication URI: http://dx.doi.org/10.1149/1.3483498

Type: Journal Article/Review

Parent Publication: ECS Transactions

Issue: 4