Developing a Wafer Level Gold-Polysilicon Eutectic Bond Process to Protect Sensitive Electronic Devices (2010)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1149/1.3483496

Publication URI: http://dx.doi.org/10.1149/1.3483496

Type: Journal Article/Review

Parent Publication: ECS Transactions

Issue: 4