Polymeric packaging of high power semiconductor devices: Material selection & reliability assessment (2013)
Attributed to:
New Thyristors for T & D Applications (NEWTON)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/eptc.2013.6745696
Publication URI: http://dx.doi.org/10.1109/eptc.2013.6745696
Type: Conference/Paper/Proceeding/Abstract