Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming (2013)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s40436-013-0039-9
Publication URI: http://dx.doi.org/10.1007/s40436-013-0039-9
Type: Journal Article/Review
Parent Publication: Advances in Manufacturing
Issue: 3