The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints (2015)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-015-3964-5
Publication URI: http://dx.doi.org/10.1007/s11664-015-3964-5
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 1
ISSN: 0361-5235