Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process (2015)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-015-4121-x
Publication URI: http://dx.doi.org/10.1007/s11664-015-4121-x
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 1
ISSN: 0361-5235