Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry (2015)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2015.08.005
Publication URI: http://dx.doi.org/10.1016/j.microrel.2015.08.005
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
Issue: 12