High-temperature (>500°c) wall thickness monitoring using dry-coupled ultrasonic waveguide transducers (2011)

First Author: Cegla F

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tuffc.2011.1782

PubMed Identifier: 21244983

Publication URI: http://europepmc.org/abstract/MED/21244983

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

Issue: 1

ISSN: 0885-3010