Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles (2016)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.matdes.2016.06.121
Publication URI: http://dx.doi.org/10.1016/j.matdes.2016.06.121
Type: Journal Article/Review
Parent Publication: Materials & Design