Study on the effects of small swing of junction temperature cycles on solder layer in an IGBT module (2016)

First Author: Yigao Chen
Attributed to:  Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ipemc.2016.7512813

Publication URI: http://dx.doi.org/10.1109/ipemc.2016.7512813

Type: Conference/Paper/Proceeding/Abstract