Study of Height Reduction of Sn99Cu1/Cu Solder Joints as a Result of Isothermal Aging (2015)

First Author: Chen Z

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-015-3979-y

Publication URI: http://dx.doi.org/10.1007/s11664-015-3979-y

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 11