A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching (2017)

First Author: Wang H

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tnano.2017.2662218

Publication URI: http://dx.doi.org/10.1109/tnano.2017.2662218

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Nanotechnology

Issue: 2