Use of Supramolecular Assemblies as Lithographic Resists (2017)

First Author: Lewis S
Attributed to:  A modular approach to multi-component molecular assemblies funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/ange.201700224

Publication URI: http://dx.doi.org/10.1002/ange.201700224

Type: Journal Article/Review

Parent Publication: Angewandte Chemie

Issue: 24