Nucleation of tin on the Cu6Sn5 layer in electronic interconnections (2017)
Attributed to:
Future Liquid Metal Engineering Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.actamat.2016.10.008
Publication URI: http://dx.doi.org/10.1016/j.actamat.2016.10.008
Type: Journal Article/Review
Parent Publication: Acta Materialia