Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables (2018)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2018.02.024
Publication URI: http://dx.doi.org/10.1016/j.microrel.2018.02.024
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability