Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni (2018)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.intermet.2018.08.002
Publication URI: http://dx.doi.org/10.1016/j.intermet.2018.08.002
Type: Journal Article/Review
Parent Publication: Intermetallics