IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices (2018)

First Author: Johnson M

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/mpel.2018.2822246

Publication URI: http://dx.doi.org/10.1109/mpel.2018.2822246

Type: Journal Article/Review

Parent Publication: IEEE Power Electronics Magazine

Issue: 2