Hermetic packaging for implantable microsystems: Effectiveness of sequentially electroplated AuSn alloy. (2018)

First Author: Szostak KM

Attributed to: Application for Strategic Equipment: Wafer Bonder at LCN funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/embc.2018.8513272

PubMed Identifier: 30441204

Publication URI: http://europepmc.org/abstract/MED/30441204

Type: Journal Article/Review

Volume: 2018

Parent Publication: Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference

ISSN: 2375-7477