Microstructural evolution of 96.5Sn-3Ag-0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient (2018)

First Author: Chen G
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s10854-017-8489-7

Publication URI: http://dx.doi.org/10.1007/s10854-017-8489-7

Type: Journal Article/Review

Parent Publication: Journal of Materials Science: Materials in Electronics

Issue: 7