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3D Printed Interconnects on Bendable Substrates for 3D Circuits (2019)

First Author: Nassar H

Attributed to: Engineering Fellowship for Growth - Neuromorphic Printed Tactile Skin (NeuPRINTSKIN) (Ext) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/fleps.2019.8792234

Publication URI: http://dx.doi.org/10.1109/fleps.2019.8792234

Type: Conference/Paper/Proceeding/Abstract