3D Printed Interconnects on Bendable Substrates for 3D Circuits (2019)
Attributed to:
Engineering Fellowship for Growth - Neuromorphic Printed Tactile Skin (NeuPRINTSKIN) (Ext)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/fleps.2019.8792234
Publication URI: http://dx.doi.org/10.1109/fleps.2019.8792234
Type: Conference/Paper/Proceeding/Abstract