Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters (2020)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1111/jmi.12868
PubMed Identifier: 31985812
Publication URI: http://europepmc.org/abstract/MED/31985812
Type: Journal Article/Review
Parent Publication: Journal of Microscopy
Issue: 3
ISSN: 0022-2720