A novel manufacturing technique for integrating magnetic components windings on power module substrates (2019)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.23919/epe.2019.8914742
Publication URI: http://dx.doi.org/10.23919/epe.2019.8914742
Type: Conference/Paper/Proceeding/Abstract