Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections (2019)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.23919/icep.2019.8733493
Publication URI: http://dx.doi.org/10.23919/icep.2019.8733493
Type: Conference/Paper/Proceeding/Abstract