Tailoring the Cu6Sn5 layer texture with Ni additions in Sn-Ag-Cu based solder joints (2018)

First Author: Hsu Y
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546474

Publication URI: http://dx.doi.org/10.1109/estc.2018.8546474

Type: Conference/Paper/Proceeding/Abstract