Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification (2018)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.4028/www.scientific.net/ssp.273.66
Publication URI: http://dx.doi.org/10.4028/www.scientific.net/ssp.273.66
Type: Journal Article/Review
Parent Publication: Solid State Phenomena