Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si 3 N 4 substrates (2018)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/wipdaasia.2018.8734691
Publication URI: http://dx.doi.org/10.1109/wipdaasia.2018.8734691
Type: Conference/Paper/Proceeding/Abstract