Technology for integrated circuit micropackages for neural interfaces, based on gold-silicon wafer bonding (2013)

First Author: Saeidi N
Attributed to:  Application for Strategic Equipment: Wafer Bonder at LCN funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1088/0960-1317/23/7/075021

Publication URI: http://dx.doi.org/10.1088/0960-1317/23/7/075021

Type: Journal Article/Review

Parent Publication: Journal of Micromechanics and Microengineering

Issue: 7