Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects (2022)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jmapro.2021.10.065
Publication URI: http://dx.doi.org/10.1016/j.jmapro.2021.10.065
Type: Journal Article/Review
Parent Publication: Journal of Manufacturing Processes