Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array (2022)

First Author: Jiang H
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.matlet.2021.131074

Publication URI: http://dx.doi.org/10.1016/j.matlet.2021.131074

Type: Journal Article/Review

Parent Publication: Materials Letters