Thermal characterization of direct wafer bonded Si-on-SiC (2022)
Attributed to:
Silicon-Silicon Carbide (Si/SiC) Power Devices for high temperature, hostile environment applications
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1063/5.0080668
Publication URI: http://dx.doi.org/10.1063/5.0080668
Type: Journal Article/Review
Parent Publication: Applied Physics Letters
Issue: 11