Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure (2022)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.materresbull.2022.111854
Publication URI: http://dx.doi.org/10.1016/j.materresbull.2022.111854
Type: Journal Article/Review
Parent Publication: Materials Research Bulletin