Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure (2022)

First Author: Liu L
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.materresbull.2022.111854

Publication URI: http://dx.doi.org/10.1016/j.materresbull.2022.111854

Type: Journal Article/Review

Parent Publication: Materials Research Bulletin