A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints (2022)
Attributed to:
High reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.ijplas.2022.103308
Publication URI: http://dx.doi.org/10.1016/j.ijplas.2022.103308
Type: Journal Article/Review
Parent Publication: International Journal of Plasticity