Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: From ß-Sn micropillars to polycrystals with intermetallics (2022)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.msea.2022.143876
Publication URI: http://dx.doi.org/10.1016/j.msea.2022.143876
Type: Journal Article/Review
Parent Publication: Materials Science and Engineering: A