Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation (2022)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jmrt.2022.05.047
Publication URI: http://dx.doi.org/10.1016/j.jmrt.2022.05.047
Type: Journal Article/Review
Parent Publication: Journal of Materials Research and Technology