Power cycling reliability of time-reduced sintering for attaching sic diodes using nanosilver film (2018)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85068319977
Type: Other
Parent Publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems