Improved fatigue resistance in transfer-printed flexible circuits embedded in polymer substrates with low melting temperatures (2023)

First Author: Chalklen T

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1088/2058-8585/acd402

Publication URI: http://dx.doi.org/10.1088/2058-8585/acd402

Type: Journal Article/Review

Parent Publication: Flexible and Printed Electronics

Issue: 2