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Influence of Printed Encapsulation Layer on the Mechanical Reliability and Performance of V2O5 Nanowires-Based Flexible Temperature Sensors (2023)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/jflex.2023.3247985

Publication URI: http://dx.doi.org/10.1109/jflex.2023.3247985

Type: Journal Article/Review

Parent Publication: IEEE Journal on Flexible Electronics

Issue: 2