3D integrated electronics with layer by layer printing of NWs (2019)
Attributed to:
'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/fleps.2019.8792252
Publication URI: http://dx.doi.org/10.1109/fleps.2019.8792252
Type: Conference/Paper/Proceeding/Abstract