Microstructure evolution and interfacial bonding mechanisms of ultrasonically soldered sapphire/Al dissimilar joints using Sn-based solders (2022)
Attributed to:
Novel Active Soldering; Creating Enhanced joints Near-ambient Temperature (NASCENT)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.ceramint.2022.03.284
Publication URI: http://dx.doi.org/10.1016/j.ceramint.2022.03.284
Type: Journal Article/Review
Parent Publication: Ceramics International
Issue: 14
ISSN: 02728842