Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging (2022)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2022.114688
Publication URI: http://dx.doi.org/10.1016/j.microrel.2022.114688
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
ISSN: 00262714