3D Imaging of Electrical-Thermal-Mechanical Deformation on Bonding Wire Loops using Phase-Sensitive Line-field Optical Coherence Tomography (2022)

First Author: Zhao Z.

Attributed to: Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Type: Other

Parent Publication: Optics InfoBase Conference Papers

ISSN: 21622701