Transient liquid phase bonding with Ga-based alloys for electronics interconnections (2022)

First Author: Chen Y
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmapro.2022.11.005

Publication URI: http://dx.doi.org/10.1016/j.jmapro.2022.11.005

Type: Journal Article/Review

Parent Publication: Journal of Manufacturing Processes

ISSN: 15266125