Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging (2022)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/icsj55786.2022.10034730
Publication URI: http://dx.doi.org/10.1109/icsj55786.2022.10034730
Type: Conference/Paper/Proceeding/Abstract