Molecular Dynamics Simulations of the Thermal Evolution of Voids in Cu Bulk and Grain Boundaries
Attributed to:
Structural dynamics of amorphous functional oxides - the role of morphology and electrical stress
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/978-3-031-22524-6_93
Publication URI: http://dx.doi.org/10.1007/978-3-031-22524-6_93
Type: Book Chapter
Book Title: TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings (2023)
Page Reference: 1001-1010
ISSN: 23671696 23671181