Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from ß-Sn micropillars to polycrystals with intermetallics (2022)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2208.11453
Publication URI: https://arxiv.org/abs/2208.11453
Type: Other