The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures (2020)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2007.08266
Publication URI: https://arxiv.org/abs/2007.08266
Type: Other